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>
Protect components and PCB assemblies from ESD damages.
> Air bubbles
provide cushioning against physical shock.
> Meet ESD requirements
of MIL-B-81705B.
> Surface Resistivity
< 1011ohm/sq.
> Static Decay
< 2 seconds.
Available in cut
sheets, pouches, bags and roll stocks produced to
customised sizes.
- Single Layer Bubble
Construction
- Double Layer Bubble Construction
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project... |
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Clear Amide Free PE Bag
>
Low density Polyetheylene(PE) Free from additive of
Amide, DOP and Silicon.
> Clear Transparent
bag, good for packing metal parts, components or casting
without contaminations.
> Available in
customised size.
> Customised
printing.
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